3D Power Packaging with Focus on Embedded Substrate Technologies
نویسنده
چکیده
The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide many opportunities for innovation. These industries are in the focal point of the “energy challenge” a multifaceted problem that involves mobile and cloud infrastructure systems, Internetof-Things, renewable energy, smart grid, vehicle electrification, and across-the-board power efficiency enhancements in order to keep up with the IT industry's rapid growth in data consumption. These are the competitiveness and sustainability challenges of the twenty-first century.
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